Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.
Broadcom Inc. has announced the availability of its 3.5D eXtreme Dimension system-in-package (XDSiP) platform technology to develop next-generation custom AI accelerators (XPUs), claiming breakthrough ...
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, ...
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