The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

One of the hardest aspects of game design to define is good level design. There is no set formula for organizing a layout, sculpting interrelated structures and objects in an environment, using ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Join members of the development team for a look at Operencia from a Design and 3D level building perspective as they discuss how a level comes to life, and more. Operencia: The Stolen Sun will be ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

3D Visualization Lecturers: 3D Visualization professionals are invited to RIT to lead lectures, discussions, and demos that give you an informed industry perspective. Industry Networking: Take part in ...

Check out more coverage of the 2022 Flash Memory Summit. Memory chip giants are upping the ante on each other with new generations of 3D NAND flash. 3D NAND chips resemble skyscrapers in which floors ...