Process control is moving forward as quickly as data collection and processing can carry it, and a recent research effort demonstrated how fast and flexible, and adaptive, machining operations can be.
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What ...
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