Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant ...

SINGAPORE, May 19, 2025 (GLOBE NEWSWIRE) -- GlobalFoundries (GFS) (GF) today announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed ...

In recent days, Amkor Technology has drawn attention as analysts highlighted its role in supplying advanced semiconductor packaging and test services for fast-growing AI-focused chips, including CPUs, ...

PTAG to acquire Construct-X, uniting leaders in AWP and digital project delivery to transform industrial capital projects through innovation and collaboration. PTAG and Construct-X, bringing together ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

GlobalFoundries has signed a Memorandum of Understanding with Singapore's Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in response to the growing ...

GlobalFoundries plans a new advanced packaging center in New York for U.S.-made semiconductor chips, supported by state and federal funding. GlobalFoundries has announced plans to establish a new ...

TORONTO, April 15, 2025 /PRNewswire/ - PTAG Inc. ("PTAG") and Intelligent Construction Experts, LLC, doing business as Construct-X ("Construct-X"), are pleased to announce that they have entered into ...