Microprocessor testing and self-test techniques constitute a critical domain in ensuring the reliability and performance of modern computing devices. These methodologies encompass both hardware and ...
A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...
Back when semiconductor devices contained only a few thousand gates, manufacturing test was almost an afterthought. The development team threw the chip “over the wall” to the test engineers, who ...
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