To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...

CMP is an integral part of the semiconductor chip manufacturing process enhancement process. Since the concept of CMP polishing applications was introduced by Walsh et al. in 1965, CMP process ...

Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.

NuTool Inc. today introduced a copper chemical mechanical planarization (CMP) process using fixed abrasive for copper polish on Ultra Low-k dielectrics. The polishing process, which demonstrated a ...

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Though a recent editorial said otherwise, the truth is that all three independent analyses of CMP's billing system were thorough and meticulous. An error has occurred ...