Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power ...

Analyzing failures in printed circuit boards (PCBs) is critical to ensure the functionality and reliability of electronic devices. A synopsis of the methods and techniques utilized in PCB failure ...

Efficiently identify and map tire fillers with streamlined material analysis—explore the details in this application note.

When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be ...

In my two previous columns, I discussed the lower and intermediate levels of the building block approach for crashworthiness testing and analysis of composite structures. I focused on the commercial ...