Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

Penn State researchers demonstrated 3D integration of semiconductors at a massive scale, characterizing tens of thousands of devices using 2D transistors made with 2D semiconductors, enabling ...

Image Fig. 1. Overview of Metamaterials in Ultrafast Optics and Photonics. The left panel illustrates the modulation of ultrashort pulses through the use of metasurfaces. This includes various ...

Engineers suggest a way to fit more transistors on a chip by seamlessly implementing 3D integration with 2D materials. Moore's Law, a fundamental scaling principle for electronic devices, forecasts ...

(Nanowerk News) Moore's Law, a fundamental scaling principle for electronic devices, forecasts that the number of transistors on a chip will double every two years, ensuring more computing power — but ...