SINGAPORE — ST Assembly Test Services Ltd. has expanded its portfolio of solutions for wireless applications with the addition of Land Grid Array (LGA). The LGA is a laminate substrate-based, fine ...
Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
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