AMD’s stock is surging, with the company now worth more than JPMorgan Chase.
Lightbits Labs Ltd. today is introducing a new architecture aimed at addressing one of the most stubborn bottlenecks in large-scale artificial intelligence inference: the growing mismatch between the ...
Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
Use left and right arrow keys to seek audio. Intel is re-entering the memory business, teaming with Japan's SoftBank on a next-generation DRAM bonding technology. Intel's Next-Generation DRAM Bonding ...
SK Hynix (000660) partners with NVIDIA on next-generation AI memory for supercomputers, personal AI, and robotics platforms ...
SK hynix announced iHBM today, a memory heat management technology designed to enhance AI system performance. The thermal packaging solution improves heat dissipation by integrating ICEs (integrated ...