One of the most expensive mistakes in product development is waiting to engage packaging engineering until after the product is developed.
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Showgoers to the biennial PACK EXPO International will agree the show delivers on one aspect: scale. Hosted at McCormick Place, Chicago (Nov. 3–6), the exhibition space took up more than 1.3 million ...
WEST CHESTER, Ohio, Nov. 06, 2025 (GLOBE NEWSWIRE) -- AeroFlexx, an industry leader in sustainable liquid packaging founded by Innventure (NASDAQ:INV), and Kinetic Vision, a leader in advanced product ...
Dr. Steen Tjarks is the CEO at T&T Design, a global packaging and artwork agency that specializes in private label. Private-label products have seen significant growth globally, and I see packaging ...
Dr. Navid Asadi’s group examines chip packaging methods such as system-in-package (SIP). This is the second of a mutlipart series on chip packaging technologies. Peter (Chengjie) Xi is currently a ...
Navid Asadi is an assistant professor in the department of electrical and computer engineering at university of Florida. His research is mainly focused on physical inspection of electronics from ...