Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).
In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
SHANGHAI, May 27, 2026 /PRNewswire/ — USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed ...
Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and ...
Power electronics packaging is experiencing new trends as a result of the needs of high power applications, with automotive market being a strong driver. The continuous electrification of functions in ...
Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...
With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...
AUBURN HILLS, Mich., April 29, 2025 /PRNewswire/ -- BorgWarner is set to showcase its latest technology at the 46th Vienna Motor Symposium from May 14-16, 2025, at the Hofburg in Vienna and will lead ...
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