Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Better understanding of the design, implementation and operation of these cyber-physical systems can enable optimized process ...
Is the smart use of process intelligence the best route to digital transformation? BMW Group thinks so. Over the last eight years, the €155-billion ($US167-billion ...
A differentiating attribute of software companies is the way they integrate customer feedback into product development. Software is designed and built so that its use creates actionable data, which is ...
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