A new technical paper titled “Oxide Semiconductor for Advanced Memory Architectures: Atomic Layer Deposition, Key Requirement ...
Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...
On December 2, 2024, the Department of Commerce, Bureau of Industry and Security (BIS) issued a new set of regulations targeting semiconductors manufacturing equipment (SME) and high-bandwidth memory ...
Micron Technology's advanced memory chips are proving essential in the AI race.
The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading ...
This record was verified by six IP experts on July 9, 2025. Dr. Yamazaki received a record certificate from a Guinness World Records adjudicator on September 17, 2025. It includes patents granted in ...
The Chosun Ilbo on MSN
Exclusive: NVIDIA presses Samsung for immediate HBM4 supply amid AI chip race
NVIDIA, the dominant player in the artificial intelligence (AI) semiconductor market, has reportedly requested Samsung Electronics to expedite the supply of its 6th-generation high-bandwidth memory ...
Memory giants Micron, SK Hynix and Samsung have led a rally in semiconductor stocks this year. Memory prices surged in 2025 and are likely to increase further in 2026 as demand for these chips which ...
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