The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

China’s memory industry is no longer a distant follower. It is now fielding a pair of aggressive specialists that are ...

AI is brilliant, but it forgets. SaaS Unicorn founder Rob Imbeault thinks that’s the biggest problem in the stack.

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

The fifth generation of High Bandwidth Memory is currently in use as HBM3E. After SK Hynix delivered samples of the upcoming HBM4 generation with 12 layers of 24 Gbit each back in March, mass ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron Technology, yielding very-high-speed DRAM. Brooke Crothers writes about mobile computer systems, ...