The most different aspect between a normal lamination structure and High-Density Fan-out (HDFO) is the routing scale. That aspect is also the challenge and focus of this study. At an HDFO scale, most ...

Experienced designers of 10 Gbits/sec (10G) Ethernet, SONET/OTN, Infiniband (QDR/FDR), and Fibre channel (16/8GFC) products are well aware that the maintenance of signal quality is far more difficult ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...

In Part 2 we related the impact on signal quality to some possible real-world basic signal and shield grounding choices (both the good and the bad). But, even in that brief discussion, it is clear ...

When we speak of “signal integrity,” or SI, we refer to a idealized digital signal that offers clean, fast transitions; stable and valid logic levels; accurate placement in time; and freedom from ...

Signal integrity is one of the many challenges faced by chip designers. Deep submicron technologies are unfriendly hosts for the nice, clean signals desired. The culprits that compromise signal ...

The data connection device under test in Figure 1 is characterized by comparing test signals sent into the link with signals measured at the link output. The differences between these two test signals ...

Are you designing a board with high-speed chipsets on either end of the link? You own the interconnect—and the risk. As clock and data rates climb, maintaining signal integrity becomes critical for ...