Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...