MarketWatch

PI Introduces Miniaturized Alignment Engine Platform for Scalable, Parallel E/O Wafer-Level Test

SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device ...
Le Lézard

PI Introduces Miniaturized Alignment Engine Platform for Scalable, Parallel E/O Wafer-Level Test

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for ...
IEEE

Characterizing an Array's Mutual Coupling via a Time-Modulated Array Technique

Abstract: In this letter, we model the mutual coupling of a time-modulated array (TMA) and investigate methods for characterizing the mutual coupling using complex-quantity and magnitude-only ...
IEEE

Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits

Abstract: This study investigates alignment and coupling between a photonic integrated circuit (PIC) and a mixed-mode fiber array (FA), where one of the channels in the normally single-mode (SM) array ...