Abstract: Mechanical testing methodologies are essential for advancing semiconductor packaging processes, ensuring the mechanical reliability of devices subjected to increasingly complex manufacturing ...
Abstract: Pulsed eddy current (PEC) testing is a nondestructive testing (NDT) method, which is highly suitable for thickness measurement and sub-surface-defect detection. In this article, PEC testing ...
Two major milestones: finalizing my database choice and successfully running a local model for data extraction.
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