Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Process control is moving forward as quickly as data collection and processing can carry it, and a recent research effort demonstrated how fast and flexible, and adaptive, machining operations can be.

How self-tuning can support an adaptive control strategy. How Model Reference Adaptive Control can improve adaptability. The different types of MRAC. A certain amount of flexibility is always good to ...

Author Dr. R. Russell Rhinehart discusses his new book, Nonlinear Model-Based Control: Using First-Principles Models in Process Control, and explains why nonlinear first-principles models should be ...

Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What ...