Abstract: Complex looping with five kinks has been commonly used in the stacked die 3-D packaging and simulation models were desired to help control the loop profile in modern thermosonic wire bonding ...
† Section on Molecular Transport, Eunice Kennedy Shriver National Institute of Child Health and Human Development, National Institutes of Health, Bethesda, Maryland 20892, United States ‡ Mathematical ...
Abstract: As the package integration density increases, the demand for reducing the bond wire length and lowering the wire loop height is constantly increasing. As the wire loop height decreases, the ...
† Department of Chemical and Biomolecular Engineering, The Ohio State University, 140 West 19th Avenue, Columbus, Ohio 43210, United States ‡ Department of Electrical Engineering, Ginzton Laboratory, ...
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