IEEE

Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding

Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...
Hosted on MSN

How a Florida grandmother became the center of an 11-year-long murder-for-hire plot

Florida State University law professor Dan Markel's last day alive began like many others. He dropped off his two young sons at preschool and went to the gym, authorities said. But things took a dark ...
CNN

Teen arrested in alleged ISIS-inspired attack plot intended for New Year’s Eve near Charlotte

This appears to be at least the second known alleged attack plot disrupted during the New Year holiday this year following a separate incident in Los Angeles, where the FBI arrested four people for ...
IEEE

2D Silicon Photonic Metalens-based Focal Plane Array (FPA) Optical Beam Steering with Wide Field-of-View (FOV) for Chip-to-Chip Optical Wireless Communication (OWC)

Abstract: We put forward and demonstrate a 2D wide field-of-view (FOV) silicon photonics (SiPh) optical beam steerer via a metalens focal plane array (FPA). We illustrate the potential implementations ...
ZDNet

I took Harvard's free online coding classes to better catch AI's errors - and they're legit

Accelerate your tech game Paid Content How the New Space Race Will Drive Innovation How the metaverse will change the future of work and society Managing the ...