Abstract: In this work, we characterize the in-plane and out-of-plane deformation of the dies following the imec die-to-wafer (D2W) bonding flow. By leveraging this result of alignment readout and ...

While the internet obsessed over juicy diss tracks, scrutinised the details of jewel heists and chased down Labubus, science moved behind the scenes in ways that altered the world. For the better or ...