Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Programming Models for Determining Optimal R&D Arrangement in Mobile Application Development Process
Abstract: The R&D (Research & Development) process of mobile application can be regarded as a complex system engineering that needs to take into account a variety of influencing elements, such as ...
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